Printing carrier tray processing

Printed circuit board (PCB) trays are specialized support devices for post-packaging and testing processes in semiconductor manufacturing. They are primarily used to fix and transport PCBs, ensuring positioning accuracy and structural stability during chip mounting, bonding, testing, and packaging. Widely applicable to the mass production of integrated circuits, power semiconductors, and micro-sensors, their processing quality directly impacts semiconductor packaging yield and production efficiency.

The processing of PCB trays places stringent requirements on raw materials, balancing rigidity, dimensional stability, abrasion resistance, and anti-static properties. The main materials fall into three categories: glass fiber reinforced epoxy resin boards, possessing excellent insulation and deformation resistance, suitable for high-precision packaging scenarios; engineering plastics such as PEEK and POM, lightweight and highly corrosion-resistant, suitable for flexible production line transport needs; and aluminum alloy profiles, with excellent heat dissipation, often used for large-size PCBs. The entire processing must be carried out in a Class 1000 or higher cleanroom to prevent dust and debris from adhering to the tray surface and contaminating semiconductor devices.

Its core processing flow encompasses four major stages: blank preparation, precision machining, surface treatment, and assembly inspection. In the blank preparation stage, a CNC cutting machine cuts the board to preset dimensions, while simultaneously chamfering removes edge burrs to prevent debris contamination during processing. Precision machining is a crucial step in tray manufacturing, employing high-speed CNC milling machines and CNC machining centers to mill the tray's positioning holes, carrier grooves, guide grooves, and vacuum adsorption holes. Positioning holes must precisely match the positioning pins of the printed circuit board, with hole tolerances controlled to an extremely small range. The flatness of the carrier grooves must be strictly calibrated to prevent the carrier board from tilting after placement, affecting chip mounting accuracy. The pore size and distribution density of the vacuum adsorption holes are designed according to the carrier board dimensions, and negative pressure adsorption further enhances transport stability.

The surface treatment process requires customized techniques based on material properties and application scenarios: plastic trays undergo sandblasting to improve surface abrasion resistance and remove machining marks; aluminum alloy trays are anodized to form a dense oxide film, enhancing corrosion resistance and insulation; all types of trays require anti-static treatment, achieved by spraying an anti-static coating or embedding anti-static fibers, controlling the surface resistance to 10⁶–10¹¹Ω to prevent electrostatic damage to semiconductor devices.

In the assembly and inspection stage, after installing locating pins, guide blocks, and other accessories, a coordinate measuring machine (CMM) is used to inspect key indicators such as the tray's hole position accuracy and flatness. Simultaneously, simulated load tests are conducted to verify the tray's structural stability under load. As semiconductor packaging technology advances towards high density and miniaturization, printed circuit board tray processing is upgrading towards customization and high precision. By optimizing mold design and processing parameters, micron-level dimensional control is achieved to meet the demands of advanced packaging technologies.