Post-packaging stamping parts

Post-packaging stamped parts are specialized structural components used in the post-packaging and testing processes of semiconductor devices. They are primarily used in lead shaping, casing encapsulation, and heat dissipation assembly, serving to secure the chip, protect internal circuitry, and strengthen electrical connections. They are widely applicable to the finished product manufacturing of integrated circuits, power semiconductors, and sensors. Their processing precision directly affects the assembly yield and operational stability of semiconductor devices.

The raw materials for these stamped parts must balance rigidity, conductivity, and corrosion resistance. Commonly used materials include brass strip, phosphor bronze strip, stainless steel sheet, and nickel-plated steel strip. In some high-reliability applications, oxygen-free copper is used to improve heat dissipation and conductivity. The processing flow is centered on precision cold stamping, encompassing five core processes: mold design, blank preparation, stamping, shaping and trimming, and surface treatment. The entire process must be carried out in a cleanroom with a Class 1000 cleanliness level or higher to prevent dust adhesion from affecting semiconductor device performance.

Die design is a crucial prerequisite for processing. Multi-station progressive dies must be customized according to the device packaging specifications, with die clearance controlled within 2%–5% of the material thickness to ensure stable dimensional tolerances of the stamped parts within ±0.01mm. The blanking process utilizes a high-speed precision press with dedicated cutting dies to cut metal coils into pre-set sizes. During the stamping stage, bending, stretching, and punching actions of the dies create complex structures such as leads, clips, and heat sink fins in a single process, replacing traditional multi-step processing and reducing accumulated dimensional errors. The shaping and trimming process uses finishing dies to correct shape and position deviations in the stamped parts, remove edge burrs, and ensure consistent lead flatness and spacing.

The surface treatment process requires selecting the appropriate process based on application requirements. Nickel plating enhances the oxidation resistance of the stamped parts, while gold plating is used for contact areas of high-frequency, high-reliability devices to reduce contact resistance. Some housing-type stamped parts undergo spray coating to enhance insulation and weather resistance.

Strict quality control is required throughout the entire processing. A 2D image measuring instrument is used to check key indicators such as pin spacing and flatness, and tensile testing is conducted to verify structural strength, ensuring a precise fit between the stamped parts and semiconductor devices. As semiconductor packaging moves towards miniaturization and high integration, post-packaging stamping is upgrading towards miniaturization and integration, enabling precise forming of materials thinner than 0.1mm to meet the demands of advanced packaging technologies.